Semiconductor Research Corporation (SRC): White papers Packaging (PKG)

The principal goal of this program is to advance fundamental knowledge and innovations to create and explore advanced evolutionary, revolutionary, and transformative packaging technologies for reliably encapsulating and efficiently integrating microsystems and enabling them to interface to the macro world. Only a very limited number of white papers will receive eventual funding.

1. Design Enablement and Tools
2. Interconnects and Architectures
3. Power Delivery, Thermal Management, and High-Speed Signaling
4. Metrology and Modeling
5. Materials

More details for each category can be found in the following document :(Research Needs Document ).

Funding:  $90K per year

https://src.secure-platform.com/a/page/pkg

Due to the agency`s IP policy, research proposals must be approved by the legal department before submission. Please contact us if considering application.