U.S. DOD/DARPA: Microsystems Technology Office (MTO) BAA (HR001118S0060) – Abstracts

(Abstracts accepted on a rolling basis until deadline)

Aim: innovative approaches that enable revolutionary advances in science, devices, or systems, in 3 areas: three target thrust areas: (1) Electronics: Managing Moore’s Inflection, (2) Spectrum: Enhancing Advantage with Agility and Autonomy, and (3) Sensors: Decentralized Sensors for the DoD. Topics include: Advanced imaging architectures and systems, Atomic physics, Chip scale sensors, Computational architectures and algorithms for next generation artificial intelligence (AI), Electro-optical/infrared (EO/IR) technologies, Electronics for harsh environments; Emerging MEMS technologies; Enabling component technology for cold-atom microsystems, Energy-efficient computing, Hardware assurance, reliability & validation, Hardware for advanced signal processing, Heterogeneous integration, Low power electronics, Low volume microsystems manufacturing, Materials for advanced microelectronics, Microelectromechanical device technology, Microsystem design & CAD, Microsystems for directed energy, Microsystems for position, navigation & timing, Microsystems for RF/optical transceivers, Non-silicon electronics, Novel photonic devices, Photonic & electronic interconnects, Processing techniques for imaging and spectral recognition, Quantum devices, Signal processing to reduce hardware requirements, Thermal management

https://beta.sam.gov/opp/68dfd959363ffdeb96f61c065e212ef7/view