Semiconductor Research Corporation - SRC: Back End Processes, Packaging, and Interface

שם: Call for Research in IPS - Back End Processes, Packaging, and Interface
תאריך הגשה: 04/05/11
לאתר הקול הקורא
תיאור כללי:

The Interconnect and Packaging Sciences (IPS) area of SRC is soliciting white papers (due Wednesday, May 4, 2011 at 3pm ET) in the areas of Back End Processes (BEP), Packaging (PKG), and Interface (INT) for contracts to be awarded as early as February 2012, for an expected three-year period. Successful white paper authors will be invited to submit full proposals. This process will be completed in two stages and only selected white papers will be advanced to the full proposal stage. We will pursue proposals based on quality, projected member value, and available funds. SRC GRC may also elect to negotiate a project's research scope or a team's composition to meet funding or synergy goals. A typical range of task funding has been in the $80-100k per year range for individual investigator-led projects.
For those who plans to submit white papers only: Jon Candelaria, Director of IPS, along with member company representatives, will host an open conference call to describe the highlighted changes to the IPS Needs Documents from last year, discuss areas of special focus, and answer any high-level logistical questions PIs and Task Leaders may have.  Date: Tuesday, March 29, 2011.

מקור: זר
תקציב: A typical range of task funding has been in the $80-100k per year range for individual investigator-led projects.
מס' שנים למחקר: 3
איש קשר: Robi, robertg@technion.ac.il, 2152
תחומים: מדעים מדויקים
סוג הקרן: הקרן אינה קרן תחרותית.
קרן ופרופילים משויכים: Semiconductor Research Corporation - SRC ,פתוח לחברי סגל הטכניון בלבד. אנא התחבר\י כדי לצפות בפרופילי המימון של הקרן (בפינה הימנית העליונה).