Semiconductor Research Corporation - SRC: Back End Processes, Packaging, and Interface
שם: |
Call for Research in IPS - Back End Processes, Packaging, and Interface תאריך הגשה: 04/05/11 לאתר הקול הקורא |
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תיאור כללי: |
The Interconnect and Packaging Sciences (IPS) area of SRC is soliciting white papers (due Wednesday, May 4, 2011 at 3pm ET) in the areas of Back End Processes (BEP), Packaging (PKG), and Interface (INT) for contracts to be awarded as early as February 2012, for an expected three-year period. Successful white paper authors will be invited to submit full proposals. This process will be completed in two stages and only selected white papers will be advanced to the full proposal stage. We will pursue proposals based on quality, projected member value, and available funds. SRC GRC may also elect to negotiate a project's research scope or a team's composition to meet funding or synergy goals. A typical range of task funding has been in the $80-100k per year range for individual investigator-led projects. |
מקור: | זר |
תקציב: |
A typical range of task funding has been in the $80-100k per year range for individual investigator-led projects. |
מס' שנים למחקר: | 3 |
איש קשר: | Robi, robertg@technion.ac.il, 2152 |
תחומים: | מדעים מדויקים |
סוג הקרן: | הקרן אינה קרן תחרותית. |
קרן ופרופילים משויכים: | Semiconductor Research Corporation - SRC ,פתוח לחברי סגל הטכניון בלבד. אנא התחבר\י כדי לצפות בפרופילי המימון של הקרן (בפינה הימנית העליונה). |