U.S. DOD/DARPA: Microsystems Technology Office (MTO)– Optimum Processing Technology Inside Memory Arrays (OPTIMA)

שם: U.S. DOD/DARPA: Microsystems Technology Office (MTO)– Optimum Processing Technology Inside Memory Arrays (OPTIMA)
תאריך הגשה: 17/05/23
לאתר הקול הקורא
תיאור כללי:

Energy | High Performance Computing | Microchips |

Abstract Due Date: March 21, 2023 (Proposers are strongly encouraged to submit an abstract in advance in order to minimize unnecessary effort in proposal preparation and review)

Seeks innovative proposals for the research and development of a fast, compact, power-efficient, and scalable compute-in-memory accelerator based on very large-scale integration (VLSI) fabrication-compatible approaches. Accelerators based on von Neumann architecture have limited computational power efficiency and long execution latency. Compute-in-memory (CIM) architectures with Multiply Accumulate Macros (MAMs) can address these limitations and greatly enhance performance. However, these implementations have been hindered by the large physical size of memory devices and the high-power consumption of peripheral circuitry. The Optimum Processing Technology Inside

Memory Arrays (OPTIMA) program aims to demonstrate area and power efficient high performance

MAMs with innovative signal processing circuits and architectures. Proposed research should investigate innovative approaches that enable revolutionary advances in science, devices, and systems.

Funding: $250,000 over the duration of the award

https://sam.gov/opp/01d2e1068c984eeb812c89db57dbf8b7/view

 

 

 

מקור: זר
תקציב: $250,000
איש קשר: Robi, 2152, robertg@trdf.technion.ac.il; iris 1272, irisbr@technion.ac.il; Orly, 1588, bakarev@trdf.technion.ac.il
תחומים: מדעים מדויקים
סוג הקרן: הקרן אינה קרן תחרותית.
קרן ופרופילים משויכים: Defense Advanced Research Projects Agency - DARPA ,פתוח לחברי סגל הטכניון בלבד. אנא התחבר\י כדי לצפות בפרופילי המימון של הקרן (בפינה הימנית העליונה).