U.S. DOD/DARPA: Microsystems Technology Office (MTO)– Miniature Integrated Thermal Management Systems for 3D Heterogeneous Integration (Minitherms3D)

Energy | Integration | Materials | Microsystems | Thermal |

The Minitherms3D program seeks to develop a compact thermal management technology scalable to an arbitrarily large number of high-power tiers in a 3D stack. The program will culminate in a demonstration with:

• 3D stacking of five tiers with total heat dissipation > 6.8 kW
• Heat rejection system < 0.006 m3

Funding: $250,000 over the duration of the award

https://sam.gov/opp/01d2e1068c984eeb812c89db57dbf8b7/view