U.S. DOD/DARPA: Microsystems Technology Office (MTO)– Large Area Device-Quality Diamond Substrates (LADDIS)

Electronics | Materials | Thermal |

MTO is interested in the following research area that may be announced as a μE topic under the

Microsystems Exploration program:

Today, diamond substrates are small (5-10 mm square) and have high dislocation density, which degrades device performance and manufacturability. Commercially available substrates also have large variability in material quality, and previous attempts at wafer size scaling exhibited extremely high defect density and cracking due to stress. The goals of a future Microsystems Exploration topic in this area would be to develop techniques for fabricating device-grade diamond substrates with diameters greater than 50 mm, low defect density, and good electrical, thermal, and mechanical properties. 

https://sam.gov/opp/9b7ea41081624f88b37210906dd4eb9a/view